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Sector · Semiconductors · 29 Jul 2026

DOE report ET-09: the split-lot that blamed etch pressure and proved something else

Factor tables, wafer maps, and confirmation lots decide whether a process change is causal—semiconductor experiment report, not ion-implant dose chains, not wet-bath notebooks, not High-NA stitching programs.

DOE report ET-09: the split-lot that blamed etch pressure and proved something else

Report ID: ET-09
Tool: Etch chamber family C (anonymized)
Symptom: CD mean shift + edge-heavy map after “pressure tweak”
Format: Designed experiment write-up. Not a brainstorming slide.


1. Objective

Determine whether chamber pressure setpoint (±8%) explains the CD shift, or whether RF hours / season kit / ESC temperature dominate.


2. Factors (coded)

| Factor | − | + | Notes | | --- | --- | --- | --- | | A Pressure | −8% | +8% | Contested knob | | B RF hours bucket | Low | High | Same chamber | | C ESC temp | Nom | +3°C | Often ignored |

Full factorial 2³ on short-loop wafers; then confirmation on product-like stack.


3. Results (compressed)

Main effect A (pressure) small.
Main effect B (RF hours) large.
Interaction B×C visible on edge dies.

Pressure narrative failed. Consumable/seasoning narrative held.

Wafer map comparison across DOE cells

A loud opinion about pressure is not a main effect.


4. Confirmation lot

High RF-hours chamber at nominal pressure reproduced the defect signature.
Low RF-hours chamber at +8% pressure did not.

Decision: freeze pressure tribal fixes; trigger kit/season playbook by RF-hour gate.


5. What we almost did wrong

  • Changed pressure on all chambers “to match the golden.”
  • No split lot.
  • No coded factors.
  • MES note: “optimized.”

That path invents tribal recipes that fight each other at the next PM.

DOE factor table printed and taped at the etch bay

If it is not coded, it is not an experiment—it is a mood.


6. Actions

| Action | Owner | | --- | --- | | RF-hour threshold → auto advisory | Equipment | | ESC temp logging mandatory in run cards | Process | | Pressure changes require ET-style DOE ID | Process + Yield | | Close ET-09 with maps in QMS | Yield |


Adjacent fences

Ion-implant dose walks own Faraday chains. Wet-bath notebooks own titration lifetime. High-NA stitching owns litho seams. AMC hunts own airborne chemistry. ET-09 owns causal honesty on an etch rumor. Do not retune all chambers because one map looked ugly.


Sign-off

Process ____ Equipment ____ Yield ____

Without three signatures, ET-09 is a PDF, not a control.

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